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Gembird TG-G3.0-01 heat sink compound 4.5 W/m·K 3 g
In stock
SKU
TG-G3.0-01
Heatsink thermal paste grease, 3 g weight
Thermal compund (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
SKU | TG-G3.0-01 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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EAN | 8716309083133 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Specification |
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Manufacturer | Gembird | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
In Stock | Y |
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